Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods

ABSTRACT

Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a stack of semiconductor dies and a thermally conductive casing at least partially enclosing the stack of semiconductor dies within an enclosure. A package substrate carries the thermally conductive casing, and an interposer is disposed between the thermally conductive casing and the stack of semiconductor dies. A peripheral portion of the interposer extends laterally beyond the stack of semiconductor dies and is coupled to a plurality of conductive members interposed between the peripheral portion and the package substrate.

TECHNICAL FIELD

The disclosed embodiments relate to semiconductor die assemblies and tomanaging heat within such assemblies. In particular, the presenttechnology relates to stacked semiconductor device assemblies having athermally conductive casing and an interposer directly attached to thecasing.

BACKGROUND

Packaged semiconductor dies, including memory chips, microprocessorchips, and imager chips, typically include a semiconductor die mountedon a substrate and encased in a plastic protective covering. The dieincludes functional features, such as memory cells, processor circuits,and imager devices, as well as bond pads electrically connected to thefunctional features. The bond pads can be electrically connected toterminals outside the protective covering to allow the die to beconnected to higher level circuitry.

Semiconductor manufacturers continually reduce the size of die packagesto fit within the space constraints of electronic devices, while alsoincreasing the functional capacity of each package to meet operatingparameters. One approach for increasing the processing power of asemiconductor package without substantially increasing the surface areacovered by the package (i.e., the package's “footprint”) is tovertically stack multiple semiconductor dies on top of one another in asingle package. The dies in such vertically-stacked packages can beinterconnected by electrically coupling the bond pads of the individualdies with the bond pads of adjacent dies using through-silicon vias(TSVs).

In vertically stacked packages, the heat generated is difficult todissipate, which increases the operating temperatures of the individualdies, the junctions therebetween, and the package as a whole. This cancause the stacked dies to reach temperatures above their maximumoperating temperatures (T_(max)) in many types of devices.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1-5 are cross-sectional views of semiconductor die assembliesconfigured in accordance with selected embodiments of the presenttechnology.

FIG. 6 is a schematic view of a system that includes a semiconductor dieassembly configured in accordance with embodiments of the presenttechnology.

DETAILED DESCRIPTION

Specific details of several embodiments of stacked semiconductor dieassemblies with improved thermal performance and associated systems andmethods are described below. The term “semiconductor die” generallyrefers to a die having integrated circuits or components, data storageelements, processing components, and/or other features manufactured onsemiconductor substrates. For example, semiconductor dies can includeintegrated circuit memory and/or logic circuitry. A person skilled inthe relevant art will also understand that the technology may haveadditional embodiments, and that the technology may be practiced withoutseveral of the details of the embodiments described below with referenceto FIGS. 1-6.

As used herein, the terms “vertical,” “lateral,” “upper” and “lower” canrefer to relative directions or positions of features in thesemiconductor die assemblies in view of the orientation shown in theFigures. For example, “upper” or “uppermost” can refer to a featurepositioned closer to the top of a page than another feature. Theseterms, however, should be construed broadly to include semiconductordevices having other orientations.

FIG. 1 is a cross-sectional view of a semiconductor die assembly 100(“assembly 100”) configured in accordance with an embodiment of thepresent technology. The assembly 100 includes a plurality ofsemiconductor dies 102 arranged in a stack 105 (“die stack 105”) and athermally conductive casing (“casing 110”) attached to an interposer 120interposed between the casing 110 and the die stack 105. The interposer120 includes a peripheral portion 122 that extends laterally beyond theouter periphery or footprint of the die stack 105 along at least oneaxis. The peripheral portion 122 includes a plurality of bond pads 123coupled to corresponding bond pads 132 of a package substrate 130 byindividual conductive members, such as solder bumps 140, interposedbetween the peripheral portion 122 and the package substrate 130. Thepackage substrate 130 can include, for example, an interposer, printedcircuit board, or other suitable substrate having electrical connectors133 (e.g., solder bumps) that connect the assembly 100 to externalcircuitry (not shown).

In the illustrated embodiment of FIG. 1, the solder bumps 140 caninclude metal solder balls. In several embodiments, the solder bumps 140can have a vertical height that is equal to or greater than the verticalheight of the die stack 105. For example, the solder bumps 140 can havea vertical height in the range of from about 200 μm to about 1 mm ormore depending on the vertical height of the die stack 105. The pitch ofthe solder bumps can likewise vary based on the vertical height of thesolder bumps. Further, while the solder bumps 140 are shown in theillustrated embodiment as having a pitch that is less than theirvertical height, in other embodiments the pitch can be the same as orlarger than the vertical height.

The casing 110 includes a cap portion 112 and wall portions 113 attachedto or integrally formed with the cap portion 112. The cap portion 112can be attached to a back side surface 121 of the interposer 120 by afirst interface material 115 a (e.g., an adhesive). The wall portions113 extend vertically away from the cap portion 112 and attach to aperipheral or upper surface 135 of the package substrate 130 by a secondinterface material 115 b (e.g., an adhesive). In the illustratedembodiment, the casing 110 at least partially encloses the die stack 105within an enclosure (e.g., a cavity). In other embodiments, the casing110 can be configured differently or omitted. For example, in oneembodiment the wall portions 113 can be omitted from the casing 110. Inaddition to providing a protective covering, the casing 110 can functionas a heat spreader that absorbs and dissipates thermal energy away fromthe die stack 105. The casing 110 can accordingly be made from athermally conductive material, such as nickel, copper, aluminum, ceramicmaterials with high thermal conductivities (e.g., aluminum nitride),and/or other suitable thermally conductive materials.

In some embodiments, the first interface material 115 a and/or thesecond interface material 115 b can be made from what are known in theart as “thermal interface materials” or “TIMs”, which are designed toincrease the thermal conductance at surface junctions (e.g., between adie surface and a heat spreader). TIMs can include silicone-basedgreases, gels, or adhesives that are doped with conductive materials(e.g., carbon nano-tubes, solder materials, diamond-like carbon (DLC),etc.), as well as phase-change materials. In some embodiments, forexample, the thermal interface materials can be made from X-23-7772-4TIM manufactured by Shin-Etsu MicroSi, Inc. of Phoenix, Ariz., which hasa thermal conductivity of about 3-4 W/m° K. In other embodiments, thefirst interface material 115 a and/or the second interface material 115b can include other suitable materials, such as metals (e.g., copper)and/or other suitable thermally conductive materials.

In several embodiments, the die stack 105 can be attached to the packagesubstrate 130 by a third interface material 115 c, such as an adhesive,a die attach material (e.g., a die attach film or paste), a dielectricspacer, or other suitable material. In one embodiment, the thirdinterface material 115 c is a dielectric material that electricallyisolates the die stack 105 from the package substrate 130 beneath thestack 105. In another embodiment, the third interface material 115 c caninclude an interface material (e.g., a TIM) used for the first interfacematerial 115 a and/or the second interface material 115 b. In otherembodiments, the third interface material 115 c can be omitted. Forexample, in one embodiment the interposer 120 can carry the die stack105 above the package substrate 130 such that the die stack 105 and thepackage substrate 130 are separated by a gap (e.g., an air gap).

The die stack 105 can be electrically coupled to the interposer 120 andto one another by a plurality of interconnects 106 (e.g., copperpillars, solder bumps, and/or other conductive features). For example, aportion of the interconnects 106 can be attached to corresponding bondpads 125 located at an active surface 124 of the interposer 120. Each ofthe semiconductor dies 102 can include a plurality of through-substrateinterconnects 108 (e.g., through-substrate vias, TSVs, etc.) that arecoupled on opposite sides to the interconnects 106. The interconnectsand the through-substrate interconnects 106 and 108 can be formed fromvarious types of conductive materials (e.g., metallic materials), suchas copper, nickel, aluminum, etc. In some embodiments, the conductivematerials can include solder (e.g., SnAg-based solder), conductor-filledepoxy, and/or other electrically conductive materials. In selectedembodiments, for example, the interconnects 106 can be copper pillars,whereas in other embodiments the interconnects 106 can include morecomplex structures, such as bump-on-nitride structures. In otherembodiments, the interconnects 106 can be replaced with other types ofmaterials or structures, such as a conductive paste.

In addition to electrical communication, the interconnects 106 and thethrough-substrate interconnects 108 transfer heat away from the diestack 105 and toward the casing 110. In some embodiments, thethrough-substrate interconnects 108 of an outer-most die 104 of the diestack 110 can also transfer heat from the die stack 110 to the packagesubstrate 130. For example, the through-substrate interconnects 108 canbe in direct contact with the third interface material 115 c. In severalembodiments, the assembly 100 can also include a plurality of thermallyconductive elements or “dummy elements” (not shown) positionedinterstitially between the semiconductor dies 102 to further facilitateheat transfer through the die stack 105. Such dummy elements can be atleast generally similar in structure and composition as theinterconnects 106 and/or the through-substrate interconnects 108 exceptthat they are not electrically coupled to the other circuitry of thesemiconductor dies 102.

An underfill material 117 can be deposited or otherwise formed aroundand/or between some or all of the semiconductor dies 102 of the diestack 105 to electrically isolate the interconnects 106 from one anotherand/or enhance the mechanical connection between the semiconductor dies102. The underfill material 117 can be a non-conductive epoxy paste(e.g., XS8448-171 manufactured by Namics Corporation of Niigata, Japan),a capillary underfill, a non-conductive film, a molded underfill, and/orinclude other suitable electrically-insulative materials. In someembodiments, the underfill material 117 can be selected based on itsthermal conductivity to enhance heat dissipation through the die stack105.

The semiconductor dies 102 can each be formed from a semiconductorsubstrate, such as silicon, silicon-on-insulator, compound semiconductor(e.g., Gallium Nitride), or other suitable substrate. The semiconductorsubstrate can be cut or singulated into semiconductor dies having any ofvariety of circuit components or functional features, such as dynamicrandom-access memory (DRAM), static random-access memory (SRAM), flashmemory, other forms of integrated circuit devices, including memory,processing circuits, imaging components, and/or other semiconductordevices. In selected embodiments, the assembly 100 can be configured asa hybrid memory cube (HMC) in which some of the semiconductor dies 102provide data storage (e.g., DRAM dies) and at least one of thesemiconductor dies 102 provides memory control (e.g., DRAM control)within the HMC. In some embodiments, the semiconductor dies 102 mayinclude other circuit components in addition to and/or other than datastorage and/or memory control components. Further although the die stack105 shown in FIG. 1 includes five dies, in other embodiments the stack105 can include fewer than five dies (e.g., three dies) or more thanfive dies (e.g., eight dies, ten dies, twelve dies, etc.). For example,in one embodiment the die stack 105 can include nine dies rather thanfive dies.

The interposer 120 can include a printed circuit board, a semiconductorsubstrate, or other suitable substrate that is formed without integratedcircuit components. For example, the interposer 120 can include a“blank” substrate formed from crystalline, semi-crystalline, and/orceramic substrate materials, such as silicon, polysilicon, aluminumoxide (Al₂O₃), sapphire, and/or other suitable materials. In one aspectof this embodiment, the interposer 120 can be formed withoutthrough-substrate interconnects because it is disposed toward the top ofthe assembly 100 rather than the bottom of the assembly. For example,conventional semiconductor die packages have the interposer disposedbetween the package substrate and the semiconductor die stack. Thisarrangement requires the interposer to have through-substrateinterconnects to electrically connect the package substrate with thesemiconductor die stack. This arrangement also requires the interposerto be thin to reduce the vertical height and the aspect ratio of thethrough-substrate interconnects. For example, conventional interposers(or the substrates used to form the interposers) can be thinned to sizeby backgrinding, etching, and/or chemical mechanical polishing (CMP).One advantage, therefore, with the interposer 120 located toward the topof the assembly is that the interposer 120 can be relatively thick andthus eliminate a number of manufacturing steps. For example, substratethinning, through-hole etching, and metal deposition processes forforming through-substrate interconnects can be eliminated. Anotheradvantage is that the increased thickness of the interposer 120 canfacilitate heat transfer laterally away from the die stack 105 andtoward the peripheral portion 122 of the interposer .

FIG. 2 is a cross-sectional view of a semiconductor die assembly 200(“assembly 200”) configured in accordance with another embodiment of thepresent technology. The assembly 200 can include features generallysimilar to those of the assembly 100. For example, the assembly 200includes the interposer 120 enclosed within the casing 110 and attachedto a semiconductor die stack 205 (“die stack 205”). In the illustratedembodiment of FIG. 2, the die stack 205 includes a logic die 202 ainterposed between a plurality of memory dies 202 b. The logic die 202 acan include, for example, a memory controller, a serializer/deserializercircuit, and/or other integrated circuit components. The individualmemory dies 202 b can include, for example, arrays or blocks of memorycells operably coupled to the integrated circuit components of the logicdie 202 a via the interconnects 106 and the through-substrateinterconnects 108.

In one aspect of this embodiment, the arrangement of the interposer 120between the logic die 202 a and the casing 110 can reduce the amount ofheat produced by the die stack 205 during operation. In general, theheat produced by a logic die (e.g., the logic die 202 a) can besignificantly larger than the heat collectively produced by memory dies(e.g., the memory dies 202 b). For instance, a logic die in an HMCassembly can consume 80% of the overall power during operation. Inconventional semiconductor die assemblies, the logic die is positionedwith the interposer toward the bottom of the assembly. As such, heatfrom the logic die transfers through the memory dies en route to thecasing of the assembly, which increases the overall temperature of theassembly. As temperature approaches or increases beyond the maximumoperating temperature (T_(max)), the operating performance of theassembly declines. For example, processing speeds (e.g., of the logicdie) often need to be reduced to maintain operation at an acceptabletemperature. In some instances, for example, data throughput needs to bereduced to one fourth of the maximum throughput level so that theassembly stays at or below T_(max). By contrast, HMC and other dieassemblies configured in accordance with several embodiments of thepresent technology can reduce the flow of heat through the memory dies202 b. In particular, the interposer 120 positions the logic die 202 aproximal to the casing 110 to direct the flow of heat away from thememory dies 202 b. This, in turn, can enable the logic die 202 a and thememory dies 202 b to operate below T_(max) and thus operate at fasterspeeds and with more data throughput.

In the illustrated embodiment of FIG. 2, the footprint of the logic die202 a is larger than the individual memory dies 202 b along at least oneaxis. In one aspect of this embodiment, certain integrated circuitcomponents of the logic die 202 a can be formed toward an outer portion201 of the logic die 202 a that is peripheral to a junction 209 betweenthe logic die 202 a and the memory dies 202 b. For example, circuitswith higher operating temperature (e.g., serializer/deserializercircuits) can be formed toward the outer portion 201. With thesecircuits positioned toward the outer portion 201, the junction 209transfers less heat and the die stack 205 can thus operate at loweroperating temperatures.

FIG. 3 is a cross-sectional view of a semiconductor die assembly 300(“assembly 300”) configured in accordance with another embodiment of thepresent technology. The assembly 300 can include features generallysimilar to those of the assembly 100. For example, the assembly 300includes the interposer 120 enclosed within the casing 110 and attachedto the die stack 105. In the illustrated embodiment of FIG. 3, theassembly 300 includes conductive members, or solder bumps 440, disposedbetween raised bond pads 323 and 332. In several embodiments, the heightof the bond pads 323 and/or the bond pads 332 can be configured toaccommodate solder bumps of various sizes and/or pitch. In addition oralternately, the height of the bond pads 323 and/or 332 can be selectedto accommodate various heights of the die stack 105. Further, in someembodiments only one set of the bond pads 323 and 332 may be raised.

As further shown in FIG. 3, the interposer 120 includes a redistributionnetwork 327 of, e.g., conductive traces, bond pads, and/or othersuitable conductive structures electrically coupled between the bondpads 323 and 125. As shown, the redistribution network 327 can includeone or more circuit elements 329 (shown schematically) coupled betweenthe bond pads 323 and 125. In several embodiments, the circuit elements329 can include capacitors, resistors, and/or other suitable circuitselements. For example, the circuit elements 329 can include large-areametal capacitors and/or inductors configured to condition the voltage orpower provided to the die stack 105 by a power supply (not shown).

FIG. 4 is a cross-sectional view of a semiconductor die assembly 400(“assembly 400”) configured in accordance with another embodiment of thepresent technology. The assembly 400 can include features generallysimilar to those of the assembly 100 of FIG. 1. For example, theassembly 400 includes the interposer 120 enclosed within the casing 110coupled to conductive structures 440 interposed between the peripheralportion 122 and the package substrate 130. In the illustrated embodimentof FIG. 4, each of the conductive structures 440 can include firstsolder bumps 442 a coupled between the bond pads 132 of the packagesubstrate 130 and corresponding bond pads 444 on an intermediary support445. The intermediary support 445 can include through-substrateinterconnects 448 that electrically couple the bond pads 444 tocorresponding bond pads 446 on an opposite side of the intermediarysupport 445. The bond pads 446 can, in turn, be coupled to the bond pads123 of the interposer 120 by second solder bumps 442 b.

In one aspect of this embodiment, the intermediary support 145 canreduce the height of the first and second solder bumps 442 a and 442 brelative to the height of the solder bumps 140 (FIG. 1). In someembodiments, the first and second solder bumps 442 a and 442 b can besmaller and the conductive structures 440 can include additional levelsof intermediary supports and solder bumps to further reduce the heightof the solder bumps. For example, in some embodiments conductivestructures can include two or more intermediary supports with solderbumps disposed between each of the intermediary supports. In severalembodiments, the intermediary support 445 can include a singularstructure that at least partially surrounds the perimeter of the diestack 105. For example, the intermediary support 445 can include apatterned interposer having an opening that receives the die stack 105.In another embodiment, the intermediary support 445 can include ametallic frame. In other embodiments, the intermediary support 445 caninclude discrete elements between a pair of solder bumps or betweenmultiple pairs of solder bumps.

FIG. 5 is a cross-sectional view of a semiconductor die assembly 500(“assembly 500”) configured in accordance with another embodiment of thepresent technology. The assembly 500 can include features generallysimilar to those of the assembly 100 of FIG. 1. For example, theassembly 500 includes the interposer 120 enclosed within the casing 110and attached to a package substrate 530. In the illustrated embodimentof FIG. 5, the package substrate 530 includes a cavity 537 having arecessed surface 539 recessed below the upper surface 135 of the packagesubstrate 530 and attached to the die stack 105 by the third interfacematerial 115 c. The interposer 120 is coupled to a plurality of solderbumps 540 located outside of the cavity 537 between bond pads 523 of theinterposer 120 and corresponding bond pads 532 of the package substrate530. In several embodiments, the solder bumps 540 can be similar to thesolder bumps of 140 of FIG. 1, but have a smaller vertical height and/orpitch.

In several embodiments, the vertical profile (e.g., height) of theassembly 500 is less than the vertical profile of the assemblies 100-400described in detail above with reference to FIGS. 1-4, respectively. Invarious embodiments, the vertical profile of the assembly 500 can bedictated in part by the depth of the cavity 537 and/or the verticalheight of the die stack 105 within the cavity 537. Although the diestack 105 shown in FIG. 5 is completely disposed within the cavity 537,in other embodiments, a portion of the die stack 105 can extend at leastpartially outside of the cavity 537 (e.g., when the die stack 105 has aheight that is greater than the depth of the cavity 537). In oneembodiment, a logic die (not shown) can be carried outside of the cavity537 while memory dies (not shown) can remain within the cavity 537.Further, in some embodiments the solder bumps 540 outside the cavity canhave the same height as the portion of interconnects 106 between theinterposer 120 and the die stack 105, while in other embodiments, thesolder bumps 540 can have a different height (e.g., a greater height)than this portion of the interconnects 106.

Any one of the stacked semiconductor die assemblies described above withreference to FIGS. 1-5 can be incorporated into any of a myriad oflarger and/or more complex systems, a representative example of which issystem 670 shown schematically in FIG. 6. The system 670 can include asemiconductor die assembly 600, a power source 672, a driver 674, aprocessor 676, and/or other subsystems or components 678. Thesemiconductor die assembly 600 can include features generally similar tothose of the stacked semiconductor die assemblies described above, andcan therefore include various features that enhance heat dissipation.The resulting system 670 can perform any of a wide variety of functions,such as memory storage, data processing, and/or other suitablefunctions. Accordingly, representative systems 670 can include, withoutlimitation, hand-held devices (e.g., mobile phones, tablets, digitalreaders, and digital audio players), computers, and appliances.Components of the system 670 may be housed in a single unit ordistributed over multiple, interconnected units (e.g., through acommunications network). The components of the system 670 can alsoinclude remote devices and any of a wide variety of computer readablemedia.

From the foregoing, it will be appreciated that specific embodiments ofthe technology have been described herein for purposes of illustration,but that various modifications may be made without deviating from thedisclosure. For example, although many of the embodiments of thesemiconductor dies assemblies are described with respect to HMCs, inother embodiments the semiconductor die assemblies can be configured asother memory devices or other types of stacked die assemblies. Inaddition, while in the illustrated embodiments certain features orcomponents have been shown as having certain arrangements orconfigurations, other arrangements and configurations are possible. Forexample, the solder bumps 140 of FIG. 1 can be disposed at a single sideof the die stack 105 rather than at both side or multiple sides. Also,the solder bumps 140 can include a larger or smaller number of solderbumps than shown in the illustrated embodiments. Further, in certainembodiments the logic die 202 a of FIG. 2 can be disposed between thememory dies 202 b and the package substrate 130 rather than between thememory dies 202 b and the interposer 120. In addition, certain aspectsof the new technology described in the context of particular embodimentsmay also be combined or eliminated in other embodiments. For example,the assembly 500 of FIG. 5 can include the circuit elements 329 of theredistribution network 327 of FIG. 3. Moreover, although advantagesassociated with certain embodiments of the new technology have beendescribed in the context of those embodiments, other embodiments mayalso exhibit such advantages and not all embodiments need necessarilyexhibit such advantages to fall within the scope of the technology.Accordingly, the disclosure and associated technology can encompassother embodiments not expressly shown or described herein.

I/we claim:
 1. A semiconductor die assembly, comprising: a stack ofsemiconductor dies; a thermally conductive casing; an interposer betweenthe thermally conductive casing and the stack of semiconductor dies,wherein a peripheral portion of the interposer extends laterally beyondthe stack of semiconductor dies; a package substrate carrying thethermally conductive casing; and a plurality of conductive membersinterposed between the package substrate and the peripheral portion ofthe interposer.
 2. The die assembly of claim 1 wherein the thermallyconductive casing includes: a cap portion attached to a back sidesurface of the interposer; and a wall portion extending verticallybetween the cap portion and the package substrate; wherein the wallportion is attached to an outer surface of the package substrate.
 3. Thedies assembly of claim 2 wherein the stack of semiconductor diesincludes: a stack of memory dies; and a logic die disposed between thestack of memory dies and the interposer.
 4. The die assembly of claim 1wherein the die assembly further comprises an interface materialinterposed between the package substrate and the stack of semiconductordies.
 5. The die assembly of claim 4 wherein: the interface material iselectrically insulative; the stack of semiconductor dies includes anoutermost die having a plurality of through-substrate interconnectsextending therethough; and the plurality of through-substrateinterconnects contact the interface material.
 6. The dies assembly ofclaim 1 wherein the stack of semiconductor dies further comprises: astack of memory dies having a first footprint; and a logic die having asecond footprint that is larger than the first footprint along at leastone axis of the stack of memory dies.
 7. The dies assembly of claim 6wherein the interposer has a third footprint that is larger than thesecond footprint along at least one axis of the logic die.
 8. The diesassembly of claim 6 wherein the individual conduct members include asolder bump.
 9. The die assembly of claim 1 wherein the interposerincludes a redistribution network electrically coupling the conductivemembers to the stack of semiconductor dies, and wherein theredistribution network includes a circuit element coupled between atleast one of the conductive members and the stack of semiconductor dies.10. The die assembly of claim 9 wherein the circuit element includes acapacitor.
 11. The die assembly of claim 1 wherein the package substrateincludes: an outer surface attached to the thermally conductive casing;and a recessed surface recessed relative to the outer surface, whereinthe stack of semiconductor dies is attached to the recessed surface. 12.A semiconductor die assembly, comprising: a thermally conductive casing;a package substrate, wherein the package substrate and the thermallyconductive casing together define an enclosure; an interposer attachedto the thermally conductive casing within the enclosure; and a stack ofsemiconductor dies disposed between the interposer and the packagesubstrate within the enclosure.
 13. The die assembly of claim 12wherein: the interposer includes a plurality of first bond pads; thepackage substrate includes a plurality of second bond pads; and thesemiconductor die assembly further comprises a plurality of conductivemembers, wherein individual conductive members are disposed betweenindividual first bond pads and individual second bond pads.
 14. The dieassembly of claim 13 wherein the individual conductive members include asolder bump.
 15. The die assembly of claim 13 wherein the plurality ofconductive members includes: individual first solder bumps coupled tothe individual first bond pads, individual second solder bumps coupledto the individual second bond pads, and an intermediary support disposedbetween the individual first solder bumps and the individual secondsolder bumps.
 16. The die assembly of claim 15 wherein the intermediarysupport includes a semiconductor material.
 17. A semiconductor dieassembly, comprising: a package substrate having a cavity; a stack ofsemiconductor dies at least partially disposed within the cavity; aninterposer attached to the stack of semiconductor dies, wherein theinterposer is outside of the cavity; and a thermally conductive casingextending laterally above the cavity, wherein the thermally conductivecasing includes a first portion attached to the package substrate and asecond portion attached to the interposer.
 18. The die assembly of claim17 wherein a peripheral portion of the interposer extends laterallybeyond the stack of semiconductor dies, and wherein the semiconductordie assembly further comprises a plurality of solder bumps interposedbetween the package substrate and the peripheral portion of theinterposer.
 19. The die assembly of claim 17 wherein the stack ofsemiconductor dies includes a stack of memory dies and a logic dieinterposed between the stack of memory dies and the interposer.
 20. Thedie assembly of claim 19 wherein the logic die is attached to thepackage substrate outside of the cavity.
 21. A method of forming asemiconductor die assembly, comprising: attaching stack of semiconductordies to an interposer; forming solder bumps between a package substrateand an active surface at a peripheral portion of the interposer; andattaching a thermally conductive casing to a back side surface of theinterposer opposite the active surface to least partially enclose theinterposer and the stack of semiconductor dies within an enclosure. 22.The method of claim 21 wherein the method further includes attaching thethermally conductive casing to the package substrate.
 23. The method ofclaim 21 wherein the method further includes attaching the stack ofsemiconductor dies to the package substrate such that the solder bumpsextend vertically between the stack of semiconductor dies and thethermally conductive casing.
 24. The method of claim 23 wherein formingthe solder bumps includes forming solder bumps having a vertical heightabout equal to or greater than a vertical height of the stack ofsemiconductor dies.
 25. The method of claim 21 wherein forming thesolder bumps includes attaching each of the solder bumps to a bond padon the interposer and to a corresponding bond pad on the packagesubstrate.
 26. The method of claim 21 wherein forming the solder bumpsincludes attaching first solder bumps to first bond pads on theinterposer; and wherein the method further comprises: attaching secondsolder bumps to second bond pads on the package substrate; and disposingan intermediary support between individual first solder bumps andindividual second solder bumps.
 27. The method of claim 21 wherein thestack of semiconductor dies includes a stack of memory dies attached toa logic die, and wherein attaching the stack of semiconductor dies tothe interposer further includes attaching the logic die to theinterposer between the interposer and the stack of memory dies.
 28. Themethod of claim 27, further comprising forming a redistribution networkon the interposer that electrically couples the solder bumps to thestack of semiconductor dies.
 29. The method of claim 28 wherein formingthe redistribution network includes forming a circuit elementelectrically coupled between the stack of memory dies and theinterposer.
 30. The method of claim 29 wherein the circuit elementincludes a capacitor.
 31. A method of forming a semiconductor dieassembly, comprising: at least partially disposing a stack ofsemiconductor dies within a cavity of a package substrate; attaching aninterposer to the stack of semiconductor dies and a peripheral surfaceof the package substrate adjacent the cavity; and at least partiallyenclosing the interposer within a thermally conductive casing.
 32. Themethod of claim 31, further comprising forming solder bumps between thepackage substrate and a portion of the interposer that is outside of thecavity.
 33. The method of claim 31, further comprising attaching thethermally conductive casing to the package substrate.
 34. Thesemiconductor die assembly of claim 31, further comprising: attaching alogic die to a stack of memory dies to form the stack of semiconductordies; and attaching the stack of memory dies to the package substratewith the cavity.
 35. A semiconductor system, comprising: a hybrid memorycube (HMC), including a package substrate, a thermally conductive casingdefining an enclosure, an interposer attached to the thermallyconductive casing within the enclosure, a stack of semiconductor dieswithin the enclosure, wherein the stack of dies includes a stack ofmemory dies and at least one logic die attached to the stack of memorydies, and a plurality of solder bumps coupled between the interposer andthe package substrate, wherein the plurality of solder bumps is adjacentto the stack of semiconductor dies; and a driver electrically coupled tothe HMC via the package substrate.